CHIP SIZE: 1.9X1.9(mm2)
br / 2.1X2.1(mm2)
br / FEATURES:
br / Low IGT=10mA max
br / Low IH=15mA max
br / BTA Family
br / Insulating Voltage=2500V(RMS)
br /
br / ABSOLUTE RATINGS(Limiting Values)
br / Symbol Parameter Value Unit
br / IT(RMS) RMS on-state current
br / (3600 conduction angle) BTA Tj=90C 4 A
br / BTB Tj=95C
br / ITSM Non-repetitive peak on-state current Tj =25C
br / Tp=8.3ms 42 A
br / Tp=10ms 40
br / I2t I2t value for fusing (tp=10ms) 80 A2S
br / DlT/dt Critical rate of rise of on-state current, Gate supply:
br / IG=50mA, dlG/dt=0.1A/? Repetitive F=50HZ 10 A/?
br / Non-repetitive 50
br / Tstg
br / Tj Storage temperature
br / Operating junction temperature -40--+150
br / -40--+110
br /
br / Symbol Parameter BTA/BTB04 Unit
br / 400T/D/S/A 600T/D/S/A 700T/D/S/A
br / VDRM
br / VRRM Repetitive peak off-state voltage Tj=110C
br / 400 600 700 V
br /
br / THERMAL RESISTANCES
br / Symbol Parameter Value Unit
br / Rth (j-c)DC Junction to case BTA 4.4 C/w
br / BTB 3.2
br / Rth (j-c)DC 3600 conduction angle, Junction to case BTA 3.3 C/w
br / BTB 2.4
br / Rth (j-a) Junction to ambient 60 C/w
br /
br / ELECTRICAL CHARACTERISTICS(Tj=25C unless otherwise stated)
br / Symbol Test conditions Quadrant BTA/BTB04 Unit
br / T D S A
br / IGT VD=12V(DC), RL=33?Tj=25C 1-2-3 Max 5 5 10 10 mA
br / 4 5 10 10 25
br / VGT VD=12V(DC), RL=33?Tj=25C ALL Max 1.5 V
br / VGD VD=VDRM, RL=3.3K?Tj=110C ALL Min 0.2 V
br / Tgt VD=VDRM, IG=40mA, dlG/dt=0.5A/ us Tj=25C
br / ALL Typ 2 us
br / IH IT=100mA gate open Tj=25C Max 15 15 25 25 mA
br / IL IG=1.2IGT Tj=25C 1-3-4 Typ 10 10 20 20 mA
br / 2 20 20 40 40
br / Dv/dt VD=67%VDRM, gate open Tj=110C Typ 10 10 -- -- v/us
br / Min -- -- 10 10
br / (dlT/dt)c (dlT/dt)c=1.8A/ms Tj=110C Typ 1 1 5 5 A/us
br / VTM ITM=5.0A, tp=380? Tj=25C Max 1.65 V
br / IDRM
br / IRRM VDRM rated
br / VRRM rated Tj=110C Max 0.01 mA
br / Tj=25C Max 0.5 mA
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